Small size electronic part and a method for manufacturing the same, and a method for forming a via hole for use in the same

ABSTRACT

A small size electronic part comprises a silicon substrate having a functional element and a signal output portion to output a signal from the functional element to outside the electronic part; a glass substrate provided on the silicon substrate such that the signal output portion of the silicon substrate is in contact with the glass substrate; a communicating hole provided in the glass substrate and at least a portion of the signal output portion of the silicon substrate so as to pass through the glass substrate and cut into at least a part of the signal output portion; and a conductive film provided on an inner wall surface of the communicating hole and extending on a surface of the glass substrate.

This is a division of application Ser. No. 09/460,672, filed Dec. 14,1999, now U.S. Pat. No. 6,300,676.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a small size electronic part such as,for example, an angular velocity sensor, acceleration sensor, mechanicalfilter, etc. to a small size electronic part having an electrodeterminal output providing an electric signal and a method formanufacturing such and a method for forming a via hole for use in such asmall size electronic part.

2. Description of the Related Art

Generally, an angular velocity sensor, acceleration sensor, mechanicalfilter, etc. is widely known as a small size electronic part produced bya silicon micromachining technique. Further, such a small sizeelectronic part comprises, for example, a silicon substrate, and glasssubstrates which are bonded to the upper and lower surfaces of thesilicon substrate, respectively. A functional element for detecting anangular velocity is formed in the silicon substrate, for example, andthe functional element is sealed by the two glass substrates.

Such a conventional small size electronic part may be mounted on thesurface of a circuit board. Further, in order to make the circuit boardsmall-sized, it is required to reduce the mounting surface of the smallsize electronic part. To this end, there has been known a small sizeelectronic part in which a via hole passing through the upper glasssubstrate is formed and an electric signal is lead out from thefunctional element through the via hole so that the functional elementand circuit board are electrically connected (See Japanese UnexaminedPatent Publication No. 10-213441).

More specifically, in the small size electronic part, a glass substratehaving a via or through hole therein is bonded to a silicon substrate,and conductive paste (or metal) is filled in the through hole, so thatan external circuit board is made to be electrically connected to thefunctional element using the conductive paste.

The aforementioned conventional technique has a drawback that, when theconductive paste is filled in the through hole, air bubbles may beproduced in the conductive paste. This causes a problem of contactfailure caused by these air bubbles and the reliability is thereforedecreased.

In particular, when the communicating hole is made of a small diameterand given that the electronic parts are made small-sized, air bubblesare more likely to be produced, and therefore in order to avoid this thethrough hole must be made of a larger diameter and accordingly there hasbeen a problem that the part size is increased and the mounting surfaceincreases in size.

Moreover, because the thermal expansion coefficient of the conductivepaste is different from that of glass material, when a temperaturechange is produced in a small size electronic part, there are cases inwhich cracks occur in the glass substrate.

In order to lead out an electric signal from a functional elementreliably, it is possible to provide a conductive film on the internalwall surface of the communicating hole as a substitute for theconductive paste. In this case, however, when a through hole isprocessed in a glass substrate by sandblasting, chips (broken pieces ofglass or their traces) may be produced on the side of the surface of theglass substrate to which a silicon substrate is joined. Because of this,when the surfaces of a silicon substrate and glass substrate are joined,a step-like portion is produced between the silicon substrate and thethrough hole by the chip. As a result, when a conductive film isprocessed on the internal wall surface of the through hole, theconductive film may be disconnected by these step-like portions andthere is a problem of decreased yields.

SUMMARY OF THE INVENTION

The present invention has been made in view of the above problems of theconventional technique, and it is an object of the invention to providea small size electronic part in which a signal output from a functionalelement is lead to the outside reliably.

It is also an object of the invention to provide a method formanufacturing such a small size electronic part, as well as a method forforming a via hole for use in such a small size electronic part.

According to the invention, the small size electronic part comprises: asilicon substrate having a functional element and a signal outputportion to output a signal from the functional element outside theelectronic part; a glass substrate provided on the silicon substratesuch that the signal output portion of the silicon substrate is incontact with the glass substrate; a communicating hole provided in theglass substrate and in at least a portion of the signal output portionof the silicon substrate so as to pass through the glass substrate andcut into at least a part of the signal output portion; and a conductivefilm provided on an inner wall surface of the communicating hole andextending on a surface of the glass substrate.

As constructed this way, the communicating hole is provided so as topass through the glass substrate and in succession to this be cut intoat least a part of the signal output portion, and the conductive film isprovided on the internal wall surface of the through hole, and formed soas to extend to the surface side of the glass substrate. The internalwall surface of the communicating hole is continuously provided from theglass substrate to the silicon substrate. Because of this, disconnectionof the conductive film caused by chips between the glass substrate andsilicon substrate is avoided, and because of this conductive film, thefunctional element and the outside can be electrically connected throughthe signal output potion.

The functional element may be sealed by the glass substrate, so that thespace for accommodating the functional element can be made substantiallya vacuum. Because of this, for example, in a functional elementcontaining a vibrator, the vibrator can be vibrated in a condition sothat air resistance applied to the vibrator is reduced.

The communicating hole is preferably formed with a tapered shape so thatthe diameter is gradually reduced over from the opening side of a glasssubstrate to a silicon substrate. According to this structure, when thecommunicating hole is viewed from the opening side of the glasssubstrate nearly the whole of the internal wall surface can be madeexposed, and a conductive film can be easily processed on the internalwall surface of the communicating hole by means of sputtering, etc.

A soldering bump may be provided in a part of a conductive film locatedon the surface side of the glass substrate. By connecting the solderingbump to an electrode pad, provided on an external circuit board, thefunctional element can be electrically connected to external equipment.

The functional element may be constructed as a detecting element fordetecting external force including angular velocity and acceleration.

The small size electronic part may comprise another glass substratebonded to a back side of the silicon substrate. According to thisstructure, the two glass substrates are bonded to the surface side andback side of the silicon substrate, whereby the functional elementformed in the silicon substrate can be sealed.

The silicon substrate may comprise an SOI substrate having an insulatingfilm, a first silicon layer in which a functional element and signaloutput portion are processed and which is provided on the surface sideof the insulating film, and a second silicon layer which is provided onthe back side of the insulating film, the glass substrate being providedon the surface side of the first silicon layer of the SOI substrate, anda communicating hole is provided in the glass substrate and firstsilicon layer. In this way, a small size electronic part can be also beconstructed using an SOI substrate.

A method of manufacturing a small size electronic part according to theinvention comprises a thin portion processing step for processing a thinportion in a silicon substrate by providing a concave groove portion ona first surface of the silicon substrate, a first joining step forjoining the surface of a first glass substrate to the surface of thesilicon substrate, a functional element processing step for processing afunctional element and a signal output portion to output a signal fromthe functional element to the outside in the thin portion of the siliconsubstrate, a second joining step for joining the surface of a secondglass substrate having an accommodating concave portion comprising aclosed space to accommodate the functional element to a second surfaceof the silicon substrate, a communicating hole processing step forprocessing a communicating hole provided so as to pass through at leasteither of the fist and second glass substrate and in succession to thisbe further cut into at least a part of the signal output portion, and aconductive film processing step for providing a conductive film on theinternal wall surface of the through hole.

According to such a manufacturing method of a small size electronicpart, first in a thin portion processing step a thin portion isprocessed by providing a concave groove potion on a first surface of asilicon substrate, next in a first joining step the surfaces of thesilicon substrate and a first glass substrate are joined by means ofanodic bonding, next in a functional element processing step afunctional element and signal output portion are processed in the thinportion and the surface of a second glass substrate is joined to asecond surface of the silicon substrate. In addition to this, in acommunicating hole processing step, a communicating hole is provided soas to pass through at least either of the first and second glasssubstrate and in succession to this processed so as to be further cutinto at least a part of the signal output portion. Last, in a conductivefilm processing step on the internal wall surface of the communicatinghole, a conductive film electrically connected to the functional elementthrough the signal output portion is provided, for example, by means ofsputtering, evaporation, etc.

In this way, as the communicating hole is provided so as to pass throughthe glass substrate and in succession to this further cut into thesilicon substrate after the surfaces of the silicon substrate and glasssubstrate have been joined, the conductive film will not be disconnectedbetween the glass substrate and silicon substrate and the functionalelement and the outside can be electrically connected by the conductivefilm.

A manufacturing method of a small size electronic part according to theinvention comprises a concave portion processing step for processing aconcave portion on the surface of a first glass substrate, a firstjoining step for joining a first surface of a silicon substrate to thesurface of the first glass substrate having the concave portion, afunctional element processing step for processing a functional elementin the part of the silicon to cover the concave portion and processing asignal output portion to output a signal from the functional element, asecond joining step for joining the surface of a second glass substratehaving an accommodating concave portion comprising a closed space toaccommodate the functional element to a second surface of the siliconsubstrate, a communicating hole processing step for processing acommunicating hole provided so as to pass through at least either of thefirst and second glass substrate and in succession to this be furthercut into at least a part of the signal output portion, and a conductivefilm processing step for providing a conductive film on the internalwall surface of the through hole.

According to such a manufacturing method of a small size electronicpart, first in a concave portion processing step a concave portion isprocessed on the surface of a first glass substrate, next in a firstjoining step a first surface of a silicon substrate is joined to thesurface of the first glass substrate, next in a functional elementprocessing step a functional element is processed in a part of thesilicon to cover the concave portion and a signal output portion tooutput a signal from the functional element is processed, and further ina second joining step the surface of a second glass substrate is joinedto a second surface the silicon substrate. In addition to this, in acommunicating hole processing step a communicating hole provided so asto pass through at least either of the first and second glass substrateand in succession to this be further cut into at least a part of thesignal output portion, is processed by, for example, sandblasting. Last,in a conductive film processing step a conductive film electricallyconnected to the functional element is provided on the internal wallsurface of the communicating hole by evaporation means such as, forexample, sputtering, etc. Through this conductive film the siliconsubstrate and the outside can be electrically connected.

A method of manufacturing a small size electronic part according to theinvention comprises a functional element processing step for processinga functional element and a signal output portion to output a signal fromthe functional element to the outside in a first silicon layer of an SOIsubstrate made up of an insulating film, the first silicon layerprovided on the surface side of the insulating film, and a secondsilicon layer provided on the back side of the insulating film, ajoining step for joining the surface of a glass substrate having anaccommodating concave portion comprising a closed space to accommodatethe functional element to the surface of the first silicon layer of theSOI substrate, a communicating hole processing step for processing acommunicating hole provided so as to pass through the glass substrateand in succession to this be further cut into at least a part of thesignal output portion, and a conductive film processing step forprocessing a conductive film on the inner wall surface of the throughhole.

According to such a manufacturing method of a small size electronicpart, first in a functional element processing step in a first siliconlayer of an SOI substrate a functional element and a signal outputportion to output a signal from the functional element are processed,and next in a joining step the surface of a glass substrate is joined tothe surface of the first silicon layer of the SOI substrate. In additionto this, in a communicating hole processing step, a communicating holeis provided so as to pass through the glass substrate and in successionto this be further cut into at least a part of the signal outputportion. In a last conductive film processing step, a conductive filmelectrically connected to the functional element is provided on theinternal wall surface of the through hole, and through this conductivefilm the silicon substrate and the outside can be electricallyconnected.

A method of forming a via hole for use in a mall size electronic partaccording to the invention is also disclosed. The method for forming avia hole for use in a small size electronic part having a functionalelement and a signal output portion to output a signal from thefunctional element to the outside comprises a joining step for joiningthe surfaces of a silicon substrate and glass substrate, a communicatinghole processing step for processing a communicating hole provided so asto pass through the glass substrate and in succession to this be furthercut into at least a part of the signal output portion, and a conductivefilm processing step for processing a conductive film on the internalwall surface of the through hole.

According to the method of forming a via hole, first in a communicatinghole processing step a communicating in hole is provided so as to passthrough a glass substrate and in succession to this be further cut intoat least a part of a signal output portion by, for example, sandblastingfrom the surface side of the glass substrate. Further, in a conductivefilm processing step, a conductive film electrically connected to afunctional element is provided on the internal wall surface of thecommunicating hole by means of, for example, sputtering, etc., and bythis conductive film a silicon substrate and the outside can beelectrically connected.

For the purpose of illustrating the invention, there is shown in thedrawings several forms which are presently preferred, it beingunderstood, however, that the invention is not limited to the precisearrangements and instrumentalities shown.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view showing an angular velocity sensor accordingto a first embodiment.

FIG. 2 is an exploded perspective view showing the angular velocitysensor of FIG. 1.

FIG. 3 is a longitudinal sectional view of a silicon substrate showingthe state before an angular velocity detecting element and frame portionare formed.

FIG. 4 is a longitudinal sectional view showing the state where a thinportion has been formed in a silicon substrate in a thin portionprocessing step.

FIG. 5 is a longitudinal sectional view showing the state where asilicon substrate and lower substrate are joined by anodic bonding in alower substrate joining step.

FIG. 6 is a longitudinal sectional view showing the state where anangular velocity detecting element is formed in a silicon substrate in afunctional element processing step.

FIG. 7 is a longitudinal sectional view showing the state where asilicon substrate and upper substrate are joined by anodic bonding in anupper substrate joining step.

FIG. 8 is a longitudinal sectional view showing the state where acommunicating hole is formed in an upper substrate and angular velocitydetecting element in a communicating hole processing step.

FIG. 9 is an expanded sectional view showing the essential part of FIG.8.

FIG. 10 is a longitudinal sectional view showing the state where aconductive film is formed on the internal wall surface of acommunicating hole in a conductive film processing step.

FIG. 11 is an expanded sectional view showing the essential part of FIG.10.

FIG. 12 is a sectional view showing an angular velocity sensor accordingto a second embodiment.

FIG. 13 is a longitudinal sectional view showing the state where aconcave portion is formed in a lower substrate in a concave portionprocessing step.

FIG. 14 is a longitudinal sectional view showing the state where a lowersubstrate and silicon substrate are joined by anodic bonding in a lowersubstrate joining step.

FIG. 15 is a longitudinal sectional view showing the state where anangular velocity detecting element is formed in a silicon substrate in afunctional element processing step.

FIG. 16 is a longitudinal sectional view showing the state where asilicon substrate and upper substrate are joined by anodic bonding in anupper substrate joining step.

FIG. 17 is longitudinal sectional view showing the state where acommunicating hole is formed in an upper substrate and angular velocitydetecting element in a communicating hole processing step.

FIG. 18 is longitudinal sectional view showing the state where aconductive film is formed on the internal wall surface of acommunicating hole in a conductive film processing step.

FIG. 19 is longitudinal sectional view showing the state where acommunicating hole is formed in a lower substrate and angular velocitydetecting element in a communicating hole processing step regarding anangular velocity sensor according to a third embodiment.

FIG. 20 is longitudinal sectional view showing the state where aconductive film is formed on the internal wall surface of acommunicating hole in a conductive film processing step.

FIG. 21 is a sectional view showing an angular velocity sensor accordingto a fourth embodiment of the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Hereinafter, the embodiments according to the present invention areexplained in detail with reference to the attached drawings. In order toshow the embodiments of the present invention, in FIGS. 1 through 21 anangular velocity sensor is taken as an example of a small sizeelectronic part and explained.

A first embodiment of the present invention is first explained withreference to FIGS. 1 through 11.

Reference numeral 1 represents a lower glass substrate for example, thethickness of which is about 400 μm, and on the surface side of the lowersubstrate 1 a silicon substrate 2 to be described later is joined byanodic bonding.

Reference numeral 2 represents a silicon substrate comprising aconductive single-crystal silicon of low resistance, and in the siliconsubstrate 2 an angular velocity detecting element 11 and frame portion12 are formed by etching.

Reference numeral 3 represents an upper glass substrate, for example,the thickness of which is about 400 μm, the back side of the uppersubstrate 3 comprising a bonding surface 3A which is joined to a signaloutput portion and frame portion 12 of the angular velocity detectingelement 11. In the middle of the side of the bonding surface 3A of theupper substrate 3 an accommodating concave portion 3B is formed. Thesurface of the upper substrate 3 opposite to the bonding surface 3Acomprises a non-bonding surface 3C. Further, the upper substrate 3 isjoined to the signal output portion and frame portion 12 of the angularvelocity detecting element 11 by anodic bonding, and between the lowersubstrate 1 and the upper substrate 3 a closed space 4 is formed.

Reference numeral 11 represents an angular velocity detecting element asa functional element (external force detecting element), and when anangular velocity Ω acts around a rotational axis X—X as shown in FIG. 2,the angular velocity detecting element 11 detects the angular velocity Ωaround this rotational axis X—X. Further, the angular velocity detectingelement 11 is formed inside the frame portion 12 by etching on thesilicon substrate 2.

The construction of the angular velocity detecting element 11 isexplained with reference to FIG. 2. Reference numeral 13 representsupport portions provided on the lower substrate 1, and referencenumeral 14 represents a vibrator which is provided in such a way thatthe vibrator is away from the surface of the lower substrate 1 becauseof a concave groove portion 15 (FIG. 1) and supported by each of thesupport portions 13 through four support beams 16, respectively. Via thesupport beams 16, the vibrator 14 is displaced in the directions ofarrow A and arrow B in FIG. 2. Further, on both sides of the vibrator 14comblike electrodes 14A are formed.

Electrode supports 17 are located on both sides of the vibrator 14 andprovided on the lower substrate 1. On the side facing the vibrator 14,of each of the electrode supports 17, a comblike electrode 17A isprovided, and each of the comblike electrodes 17A meshes with each ofthe comblike electrode 14A of the vibrator 14 with a gap between them.

Reference numeral 18 (FIG. 1) is an electrode plate located under thevibrator 14 and provided on the surface of the lower substrate 1. Whenthe vibrator 14 is displaced in the directions of arrows A and B byCoriolis force, the electrode plate 18 is to detect the displacement.

Reference numeral 19 is a lead-out portion connected to the electrodeplate 18, and the lead-out portion 19 comprises a wiring portion 19Aextended from the electrode plate 18 and a pad portion 19B provided onthe wiring portion 19A.

The support portion 13, electrode supports 17, and lead-out portion 19comprises a signal output portion to electrically connect the angularvelocity detecting element 11.

Reference numerals 20 (FIG. 1) represent four via holes (only two areillustrated) formed over from the upper substrate 3 to the angularvelocity detecting element 11, and each of the via holes 20 comprises acommunicating hole 21 to be described later and a conductive film 22provided on the internal wall surface of the communicating hole 21.

Reference numerals 21 represent through holes, and each of the throughholes 21 comprises a tapered through-hole portion 21A provided throughthe upper substrate 3 and a concave bottom portion 21B cut into each ofthe electrode support portions 17 comprising the signal output portion,of the silicon substrate 2 so as to be linked to the through-holeportion 21A. Furthermore, in the embodiment, the communicating hole 21is illustrated only in the case where the communicating hole is providedin the electrode support portion 17, but through holes are also made inthe support portion 13 and lead-out portion 19 in the same way as inFIG. 1.

Further, regarding each of the through holes 21, for example, thediameter of the opening portion on the side of the non-bonding surface3C is about 300 μm and the diameter on the side of the bonding surface3A is about 100 μm. Because of this, each of the through holes 21 isformed in a tapered shape where the diameter is gradually reduced overfrom the side of the non-bonding surface 3C of the upper substrate 3 tothe side of the silicon substrate 2.

Reference numerals 22 represent a conductive film provided on theinternal wall surface of each of the through holes 22, and theconductive film 22 is extended from the signal output portion (supportportion 13, each of the electrode support portions 17, and lead-outportion 19) of the angular velocity detecting element 11 to the side ofthe non-bonding surface 3C (outside surface) of the upper substrate 3and is to electrically connect the angular velocity detecting element 11and the outside.

Reference numerals 23 represent a soldering bump formed in a partlocated on the side of the non-bonding surface 3C of the upper substrate3, and when an angular velocity sensor is mounted on a circuit board(not illustrated) and the soldering bump 23 is to electrically connectan electrode pad provided on the circuit board and the conductive film22. By this, the angular velocity detecting element 11 outputs anelectric signal proportional to an angular velocity Ω to, for example,an oscillation circuit, detection circuit, etc. (not illustrated).

In an angular velocity sensor to be constructed this way, between acomblike electrode 14A of a vibrator 14 and a comblike electrode 17A ofan electrode support portion 17, a driving signal is applied from anexternal oscillation circuit through a soldering bump 23, conductivefilm 22, etc., and the vibrator 14 is made to be vibrated in thedirection of arrow A. In this state, when an angular velocity Ω aroundthe rotational axis X—X acts on the angular velocity sensor, Coriolisforce acts on the vibrator 14, the vibrator 14 is displaced in thedirection of arrow B in proportion to the Coriolis force, and the gapbetween the vibrator 14 and electrode plate 18 is changed.

The change of the gap is inverted into a signal of a capacitance betweenthe vibrator 14 and electrode plate 18, and this signal is output to adetecting circuit through the conductance film 22 and soldering bump 23.In the detecting circuit, the capacitance is changed into a voltage, andaccordingly an angular velocity Ω applied around the rotational axis X—Xcan be measured.

Next, based on FIGS. 3 through 11, a manufacturing method of an angularvelocity sensor according to the present embodiment is described.

FIG. 3 shows a silicon substrate 2 before the substrate is subjected toprocesses such as etching treatment. In this silicon substrate 2, anangular velocity detecting element 11 and frame portion 12 are processedin a functional element processing step to be described later.

In a thin portion processing step shown in FIG. 4, after a masking film(not illustrated) has been formed on the back side of the siliconsubstrate 2, a concave groove portion 15 is formed by etching and thepart, corresponding to the concave portion 15, of the silicon substrate2 becomes a thin portion 2A.

In a lower substrate joining step as a first joining step shown in FIG.5, after the back side of the silicon substrate 2 has been physicallyplaced against a lower substrate 1 having an electrode plate 18 formedin advance nearly in the middle portion therein, while these are heatedto a joining temperature, a voltage of, for example, about 1000 volts isapplied to the lower substrate 1 and silicon substrate 2 and bothsurfaces of the silicon substrate 2 and lower substrate 1 are joined byanodic bonding.

Next, in a functional element processing step shown in FIG. 6, after amasking film (not illustrated) patterned after an angular velocitydetecting element 11 and frame portion 12 has been formed, etchingtreatment is carried out from the surface side of the silicon substrate2 through the masking film, the angular velocity detecting element 11 isformed in the location corresponding to the thin portion 2A, of thesilicon substrate 2 and on its outside the frame portion 12 isprocessed.

In an upper joining step as a second joining step shown in FIG. 7, anupper substrate 3, on the back side of which an accommodating concaveportion 3B is formed in advance, is brought into contact with a bondingsurface 3A so as to cover the angular velocity detecting element 11, anda support portion 13, each of electrode support portions 17, andlead-out portion 19 (See FIG. 2), and a frame portion 12 constituting asignal output portion, of the angular velocity detecting element 11 arebrought into contact with the bonding surface 3A. These surfaces arejoined by anodic bonding in a reduced atmospheric pressure. At thistime, the angular velocity detecting element 11 is now sealed in theclosed space 4.

In a communicating hole processing step shown in FIGS. 8 and 9, after amasking film (not illustrated) patterned after a communicating hole 21(for example, of a circular shape of about 250 μm in diameter) has beenformed on the side of a non-bonding surface 3C of the upper substrate 3,tapered through holes 21 are processed by a mechanical means such as,e.g., sandblasting. At this time, each of the through holes 21 iscomposed of a through-hole portion 21A disposed so as to pass throughthe upper substrate 3 and a concave bottom portion 21B linked to thethrough-hole portion 21A, further cut into each of electrode supportportions constituting the signal output portion. See FIG. 9. Because ofthis, the communicating hole 21, in which the diameter on the side ofthe non-bonding surface 3C is about 300 μm and the diameter on the sideof the bonding surface 3A is about 100 μm, is formed in a tapered shapewhere the diameter is gradually decreased from the non-bonding surface3C to the bonding surface 3A, and because the depth of the communicatinghole 21 is about 450 μm the concave bottom portion 21B is provided onthe surface side of the electrode support portion 17.

Further, in a conductive film processing step shown in FIGS. 10 and 11,a metal mask (not illustrated) is arranged on the side of thenon-bonding surface 3C of the upper substrate 3 according to thelocation of the communicating hole 21, a metal thin film of e.g.,aluminum, is formed on the internal wall surface of the communicatinghole 21 of the upper substrate 3 by means of e.g., sputtering, whileusing the metal mask as a mask, and thus a conductive film 22 isprovided. In this way, in the communicating hole processing step andconductive film processing step, a via hole 20 made up of acommunicating hole 21 and conductive film 22 is processed in a partlocated in the non-bonding surface 3C of the upper substrate 3. Theconductive film 22 may comprise a foundation metal of nickel, platinum,etc. Further, a soldering bump 23 is formed on the foundation metalusing solders (an alloy of lead and tin, and so on) (see FIG. 1).

At the same time, according to the present embodiment, in an uppersubstrate joining step, after the surface of the upper substrate 3 hasbeen joined to the silicon substrate 2, the communicating hole 21 of thevia hole 20 is provided so as to pass through the upper substrate 3 andthe electrode support portion 17 comprising the signal output portion ofthe angular detecting element 11. After the upper substrate 3 andsilicon substrate 2 have been securely joined, the communicating hole 21can be made. Because of this, when the communicating hole 21 isprocessed in the upper substrate 3 using mechanical processing meanssuch as, e.g., sandblasting, chips and debris, are not produced on theside of the bonding surface of the upper substrate 3 and a continuouscommunicating hole 21 can be provided between the upper substrate 3 andsilicon substrate 2.

As a result, when the conductive film 22 of the via hole 20 is depositedon the internal wall surface of the communicating hole 21, disconnectionof the conductive film 22 due to the chips or other debris is avoided,and the angular velocity detecting element 11 and an external detectingcircuit, can be reliably electrically connected by the conductive film22.

Further, if the conductive film 22 is formed on the internal wallsurface of the communicating hole 21 by means of, e.g., sputtering, incomparison with the case in which a conductive paste is filled in thecommunicating hole 21 as in the conventional technique, the holediameter of the communicating hole 21 can be reduced, and furthermore asmall-sized angular velocity sensor can be provided.

Further, because the communicating hole 21 of via hole 20 is formed in atapered shape where the diameter gradually decreases from thenon-bonding surface 3C of the upper substrate 3 to the bonding surface3A, when looked at from the side of the non-bonding surface of the uppersubstrate 3, nearly the whole of the internal wall surface of thecommunicating hole 21 can be made exposed and accordingly, a conductivefilm 22 with increased adhesiveness can be easily processed on theinternal wall surface of the communicating hole 21 using sputtering, forexample.

Moreover, as a soldering bump is provided in a part located in thenon-bonding surface 3C of the upper substrate 3, of the conductive film22, compared with the case in which the soldering bump 23 is directlyconnected to the concave bottom portion 21B of the communicating hole21, the diameter of the communicating hole 21 can be decreased.Furthermore, because of the bump 23, an angular velocity sensor can bemounted on the surface of an external circuit board and the mountingsurface of the angular velocity sensor can be decreased.

In this way, according to the present embodiment, the angular velocitydetecting element 11 and an external oscillation circuit and detectingcircuit can be securely connected by the conductive film 22 of the viahole 20, and the reliability of the angular velocity sensor can beincreased. Furthermore, because the conductive film 22 is notdisconnected, the productivity can be improved by the increase of yield.

On one hand, in an upper substrate joining step for joining the surfaceof the upper substrate 3 to the silicon substrate 2, as the joining ismade to take place in a reduced atmospheric pressure, a closed space canbe sealed in a condition such that the atmospheric pressure is reducedin the space and air resistance applied to the vibrator 14 of theangular velocity detecting element 11 can be decreased. As a result, thevibrator 14 can be vibrated at a high speed and at high amplitude andaccordingly, the detecting ability of the angular velocity detectingelement 11 can be improved.

Furthermore, because the conductive film 22 is provided on the internalwall surface of the communicating hole 21, even if the temperature ofthe angular velocity sensor is changed, despite the difference ofthermal expansion coefficient between the conductive film 22 and uppersubstrate 3, the stress applied to the upper substrate 3 by theconductive film 22 is light, the appearance of cracks on the uppersubstrate 3 is suppressed and the life of the angular velocity sensorcan be prolonged.

Next, an external force detecting device according to a secondembodiment of the present invention, in particular, an example of anangular velocity sensor, is explained with reference to FIGS. 12 through18. The present embodiment is characterized in that an accommodatingconcave portion is provided in a glass substrate on the upper side of asilicon substrate and a concave groove portion is provided in a glasssubstrate on the lower side of the silicon substrate. Moreover, in thepresent embodiment, the same reference numerals are given the samecomponents as in the above first embodiment, and their explanation isomitted.

Reference numeral 31 represents a lower substrate comprising glass, andin the middle portion of the lower substrate 31 a concave portion 31A isformed. Further, on the surface side of the lower substrate 31 anangular velocity detecting element 41 and frame portion 42, to bedescribed later, are provided by a silicon substrate 32 joined to thesurface of the lower substrate. Furthermore, on the surface side of thesilicon substrate 32 the surface of an upper substrate 33, to bedescribed later, is joined and on the bottom portion of the concaveportion 31A of the lower substrate 31 an electrode plate 18 is formed.

Reference numeral 33 represents an upper substrate comprising glass, andthe back side of the upper substrate 33 comprises a bonding surface 33Afor joining to the angular velocity detecting element 41 and frameportion 42 and in the middle of the bonding surface 33A of the uppersubstrate 33, an accommodating concave portion 33B is formed. Further,the surface opposite to the bonding surface 33A comprises a non-bondingsurface 33C. The bonding surface 33A of the upper substrate 33 is joinedto the signal output portion and frame portion 42 of the angularvelocity detecting element 41 by anodic bonding, and a closed space isgiven between the lower substrate 31 and upper substrate 33.

Reference numeral 41 represents the angular velocity detecting element,and although the angular velocity sensor 41 is constructed nearly in thesame way as the above angular velocity detecting element 11, the angularvelocity sensor is different in that the vibrator 14 is away from thesurface of the lower substrate 31 because of the concave portion of thelower substrate 31. Further, the angular velocity detecting element 41is processed together with the frame portion 42 by etching on thesilicon substrate 32.

Next, based on FIGS. 13 through 18, a manufacturing method of an angularvelocity sensor according to the present embodiment is described.

First, in a concave portion processing step shown in FIG. 13, after amasking film (not illustrated) has been formed on the surface of thelower substrate 31, the concave portion 31A is formed by etching and inthe concave portion 31A an electrode plate 18 is processed.

In a lower substrate joining step, as a first joining step shown in FIG.14, after the lower surface of the silicon substrate 32 has beenphysically disposed against the lower substrate 31 having the concaveportion 31A formed by the concave portion processing step, while theseare heated to a joining temperature, a voltage of, for example, about1000 volts, is applied to the lower substrate 31 and silicon substrate32 and both surfaces of the silicon substrate 32.

Next, in a functional element processing step shown in FIG. 15, after amasking film (not illustrated) patterned after the angular velocitydetecting element 41 and frame portion 42, etching is performed from theupper side of the silicon substrate 32 through the masking film and theangular velocity detecting element 41 and frame portion 41 are processedfrom the silicon substrate 32.

In an upper substrate joining step as a second joining step shown inFIG. 16, the upper substrate 33 having an accommodating concave portion33B formed in advance is brought into contact with a bonding surface 33Aso as to cover the angular velocity detecting element 41, and a signaloutput portion (only each of electrode support portions 17 areillustrated) and the frame portion 42 of the angular velocity detectingelement 41 are brought into contact with the bonding surface 33A. Thesesurfaces are joined by anodic bonding in a reduced atmospheric pressure.At this time, the angular velocity detecting element is sealed in theclosed space 43.

In a communicating hole processing step shown in FIG. 17, after amasking film (not illustrated) patterned after a communicating hole 21(for example, of a circular shape of about 330 μm in diameter) has beenformed on the side of a non-bonding surface 33C of the upper substrate33, through holes 21 are processed by sandblasting, for example. At thistime, each of the communicating holes 21 comprises a taperedthrough-hole 21A passing through the upper substrate 33 and a concavebottom portion 21B linked to the through-hole portion 21A, cut into theelectrode support portion 17 constituting a signal output portion of thesilicon substrate 32.

Further, in a conductive film processing step shown in FIG. 18, a metalmask (not illustrated) is arranged according to the location of thecommunicating hole 21, and a metal thin film of, e.g., aluminum, isformed on the internal wall surface of the communicating hole 21 of theupper substrate 33 by means of, for example, sputtering, while using themetal mask as a mask and thus a conductive film is provided. Theconductive film 22 leads a signal to be output from the angular velocitydetecting element 41 to the side of the non-bonding surface 33C of theupper substrate 33. In this way, by the communicating hole processingstep and conductive film processing step, a via hole 20 comprising acommunicating hole 21 and conductive film 22 is formed.

Thus, in the present embodiment also, after the surfaces of a lowersubstrate 31 and silicon substrate 32 have been joined, a communicatinghole 21 is formed so as to reach an electrode support portion 17. Theconductive film 22 is formed on the internal wall surface of thecommunicating hole 21, and a via hole 20 comprising the communicatinghole 21 and conductive film 22 is thus formed. Accordingly an angularvelocity detecting element 41 is electrically connected to an outsidedetecting circuit, through the conductive film 22 of the via hole 20 andthe reliability of the angular velocity sensor is improved.

Next, as an external force detecting device according to a thirdembodiment of the present invention, an example of an angular velocitysensor is provided and explained with reference to FIGS. 19 and 20. Thepresent embodiment is characterized in that a communicating hole isprovided in a lower substrate and a conductive film is provided on theinternal wall surface of the through hole. Moreover, in the presentembodiment, the same reference numerals are provided the same componentsas in the above first embodiment, and their explanations are omitted.

Reference numeral 51 represents a lower substrate comprising glass. Onthe lower substrate 51, the surface of an above-mentioned siliconsubstrate 2 having an angular velocity detecting element 11 and frameportion 12 is joined. On the surface of the silicon substrate 2, anupper glass substrate 52 is provided, and between the lower substrate 51and upper substrate 52 a closed space 53 is provided. Further, in thepresent embodiment, a via hole 54, to be described later, is formed inthe lower substrate.

Reference numerals 54 represent four via holes (only two illustrated)formed from the lower surface of the lower substrate 51 to an angularvelocity detecting element 11, and each of the via holes 54 comprises acommunicating hole 55 to be described later and a conductive film 56provided on the internal wall surface of the communicating hole 55.

Reference numerals 55 represent through holes, and each of the throughholes 55 comprise a through-hole portion 55A passing through the lowersubstrate 51 and a concave bottom portion 55B in succession to thethrough-hole portion 55A, cut in an electrode support portion 17comprising a signal output portion, of the silicon substrate 2.

Reference numerals 56 represent a conductive film provided on theinternal wall surface of each of the through holes 55, and theconductive film 56 is extended from the support portion 13, each ofelectrode support portions 17, and a lead-out portion 19 (only electrodesupport portion 17 illustrated) of the angular velocity detectingelement 11 to the back side of the lower substrate 51 and is toelectrically connect the angular velocity detecting element 11 and theoutside.

The angular velocity sensor according to the present embodiment has theabove construction, and next a forming method of the via holes isexplained. Moreover, the steps prior to the processing of via the holesare the same as in FIGS. 3 through 7 according to the above firstembodiment, and their explanation is omitted.

First, in a communicating hole processing step shown in FIG. 19, after amasking film (not illustrated) patterned after a communicating hole 55has been formed on the back side of the lower substrate 51, throughholes 55 are processed in the lower substrate 51 by, e.g., sandblasting.At this time, each of the through holes 55 comprises a taperedthrough-hole portion 55A passing through the lower substrate 51 and aconcave bottom portion 55B linked to the through-hole portion 55A, cutin the electrode support portion 7 comprising a signal output potion, ofa silicon substrate 2.

In a conductive film processing step shown in FIG. 20, a metal mask (notillustrated) is arranged according to the location of the communicatinghole 55, and a metal thin film of, e.g., aluminum, is formed on theinternal wall surface of the communicating hole 55 of the lowersubstrate 51 by means of, for example, sputtering, while using the metalmask as a mask and thus a conductive film is processed. In this way, inthe communicating hole processing step and conductive film processingstep, a via hole 54 made up of a communicating hole 55 and conductivefilm 54 is formed.

Thus, in the present embodiment also, after the surfaces of a lowersubstrate 51 and silicon substrate 2 have been securely joined, thecommunicating hole 55 is formed so as to reach a part comprising asignal output portion, of the angular velocity detecting element 11, theconductive film 56 is formed on the internal wall surface of thecommunicating hole 55, and the via hole 54 comprising the communicatinghole 55 and conductive hole 56. Because of this, the angular velocitydetecting element 11 and external detecting circuit, are electricallyconnected through the conductive film 56 of the via hole 54, andaccordingly, the reliability of the angular velocity sensor can beimproved.

Next, based on FIG. 21, a fourth embodiment according to the presentinvention is described. The present embodiment is characterized in thatan SOI substrate having a first and second silicon layer on both sidesof an insulating film is used as a silicon substrate. Moreover, in thepresent embodiment, the same components as in the above first embodimentare provided the same reference numerals, and their explanations areomitted.

Reference numeral 61 represents an SOI (Silicon On Insulator) substrate,and the SOI substrate 61 comprises an insulating film 62 comprising,e.g., a silicon oxide film, a first silicon layer 63 which is providedon the surface side of the insulating film 62 and in which an angularvelocity detecting element 11 is formed, and a second silicon layer 64which is provided on the back side of the insulating film 62 and whichcomprises a lower substrate. Further, on the surface side of the firstsilicon layer 63 of the SOI substrate 41 the surface of an uppersubstrate 3 is joined, and in the upper substrate 3 via holes 20 areformed.

Further, an accommodating concave portion 65 is formed by etching on themiddle portion of the insulating film 62, and because of theaccommodating concave portion 65, a vibrator 14, is provided so as to beaway disposed from the surface of the second silicon layer 64.

Thus, even if the SOI substrate 61 is used, an angular velocity sensorcan be constructed, and in the same way as the above angular velocitysensor according to the first embodiment, a signal to be output from theangular velocity detecting element 11 can be lead out to the outsidethrough the via hole 20.

Furthermore, in each of the embodiments, an example of an angularvelocity sensor was taken to show how a small size electronic part canbe made but the present invention may be applied to not only such asensor, but also to an acceleration sensor, mechanical filter, etc.

Further, in the communicating hole processing step, holes were made tobe cut by sandblasting, but this is not limited to this technique, andthrough holes may be processed by other techniques such as laser beammachining, electric discharge machining, etc. Further, in the joiningstep, the example of anodic bonding was used, but joining may beaccomplished with other techniques, such as by adhesive, etc., and inshort, if only the strength of adhesion between a glass substrate andsilicon substrate is secured, this is sufficient.

Further, in each of the embodiments, the conductive film 22 was made tobe directly connected to the electrode pad of a circuit board by use ofa soldering bump 23, but this is not limited to this technique in thepresent invention, and the conductive film 22 and the electrode pad of acircuit board may be connected by other techniques, such as wiring, etc.

Further, in each of the embodiments, a communicating hole 21 of a viahole 20 formed in an electrode support portion 17 was illustrated andexplained, but this is not limited to this technique, and in the supportportion 1 and lead-out portion 19 a via hole may be formed in the sameway.

Furthermore, in the communicating hole 21, the concave bottom portion21B was made to be provided in a part (for example, each of electrodesupport portions 17) comprising an angular velocity detecting element11, but the present invention this is not limited to this technique, andlike the communicating hole 21′ shown by a two-dot chain line in FIG. 9,the communicating hole may be formed in such a way that a concave bottomportion 21B′ is formed in the lower substrate 1 and the communicatinghole passes through the electrode support portion 17 (signal outputportion). Further, the communicating hole may be formed so as to passthrough the upper substrate 3, silicon substrate 2, and lower substrate1 downward.

While preferred embodiments of the invention have been disclosed,various modes of carrying out the principles disclosed herein arecontemplated as being within the scope of the following claims.Therefore, it is understood that the scope of the invention is not to belimited except as otherwise set forth in the claims.

What is claimed is:
 1. A method of manufacturing a small size electronicpart comprising: providing a thin portion in a silicon substrate byforming a concave groove on a first surface of the silicon substrate;bonding a surface of a first glass substrate to the first surface of thesilicon substrate; providing a functional element and signal outputportion in the thin portion of the silicon substrate; bonding a surfaceof a second glass substrate having an accommodating concave portioncomprising a closed space to accommodate the functional element to asecond surface of the silicon substrate; and providing a communicatinghole in at least one of the glass substrates and in at least a portionof the signal output portion of the silicon substrate so as to passthrough at least one of the glass substrates and cut into at least apart of the signal output portion; and forming a conductive film on aninner wall surface of the communicating hole and extending on a surfaceof the glass substrate.
 2. A method of manufacturing a small sizeelectronic part comprising: a concave portion processing step forproviding a concave portion on a surface of a first glass substrate; afirst joining step for joining a first surface of a silicon substrate tothe surface of the first glass substrate having the concave portionprovided therein; a functional element processing step for forming afunctional element and a signal output portion to output a signal fromthe functional element to outside the electronic part in a part of thesilicon substrate to cover the concave portion; a second joining stepfor joining a surface of a second glass substrate having anaccommodating concave portion comprising a closed space to accommodatethe functional element to a second surface of the silicon substrate; acommunicating hole processing step for forming a communicating holedisposed so as to pass through at least one of the first and secondglass substrates and further to cut into at least a part of the signaloutput portion; and a conductive film processing step for providing aconductive film on an internal wall surface of the communicating hole.3. A method of manufacturing a small size electronic part comprising: afunctional element processing step for forming a functional element anda signal output portion to output a signal from the functional elementto outside the electronic part in a first silicon layer of an SOIsubstrate comprising an insulating film, the first silicon layerprovided on a surface of the insulating film, and a second silicon layerprovided on a back surface of the insulating film; a joining step forjoining a surface of a glass substrate having an accommodating concaveportion comprising a closed space to accommodate the functional elementto the surface of the first silicon layer of the SOI substrate; acommunicating hole processing step for providing a communicating holepassing through the glass substrate and further cut into at least a partof the signal output portion; and a conductive film processing step forproviding a conductive film on an internal wall surface of thecommunicating hole.
 4. A method of forming a via hole for use in a smallsize electronic part having a functional element and a signal outputportion to output a signal from the functional element to outside theelectronic part comprising: a joining step for joining surfaces of asilicon substrate and glass substrate; a communicating hole processingstep for forming a communicating hole provided so as to pass through theglass substrate and further cut into at least a part of the signaloutput portion; and a conductive film processing step for forming aconductive film on an internal wall surface of the communicating hole.